The increased demand for wireless connectivity in portable electronic devices has driven manufacturers to deliver ever-smaller, more cost effective solutions. This makes the integration of RF into a single product more and more complex and increases technical risk while in the mean time the product development cycle has to be reduced.
Insight-SiP rapidly solves these challenges. Based on a system-in-package approach the company makes complex RF systems easy to integrate in any existing or future portable application. Insight-SiP contribute to reduce our customer’s product development cycle and accelerate their product’s release-to-market.
Insight SiP serves the market with turn-key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements.
Experts in custom multi-die RF circuit miniaturization, System-in-Package (SiP) and Antenna-in-Package (AiP) designs, Insight SiP also provides ready-to-use RF modules for Bluetooth Low Energy applications such as telecom and mobile computing, portable consumer devices, healthcare, automotive – connected cars, industrial, Internet-of-Things (IoT).
Insight SiP delivered to address the following market segments:
Telecom and Mobile Phones
Portable Consumer Devices
Automotive – Connected Cars
Insight SiP has designed a series of ultra-miniature wireless modules for various applications such as 3G, 4G/LTE, 60Ghz, ANT, Antenna Tuning, Bluetooth Smart, Bluetooth, GSM/W-CDMA, GPS/Glonass, ISM, NFC, RFID, Wireless Sensor Modules, Software Define Radio, Transfer Jet, Ultra-miniature Antennas, UMTS, UWB, WHDI, Wifi, WLAN, Zigbee …
Cidev Electronics represents INSIGHT SIP in Israel and distributes its products:
- Design and Manufacture highly integrated custom (RF) systems and sub-systems based on System In a Package (SIP) approach
- optimizing the technology choices (PCB, LTCC, Thin film, Thick film) for size, cost