Insight SiP specializes in custom multi-die RF circuit miniaturization, System-in-Package (SiP) and Antenna-in-Package (AiP) designs. The System in Package (SiP) approach consists of integrating several different components from different semiconductor and passive technologies into a single package or miniaturized module. This allows for extremely rapid and low cost development cycles. Insight SiP combines its RF know-how with the unique ability to embed functions within the package irrespective of the technology: organic substrates (BT, FR4…), multi-layer ceramic substrates (LTCC, HTCC, Thick film…) or thin film Integrated Passive Devices (IPD) on silicon or glass. The company has successfully designed a series of ultra-miniature wireless modules for various applications such as 3G, 4G/LTE, 60Ghz, Antenna Tuning, Bluetooth/BLE, GSM/W-CDMA, GPS/Glonass, NFC, RFID, WHDI, Wifi, WLAN, Zigbee etc. Insight SiP are active globally and are represented in Israel by CIDEV ELECTRONICS.

We are proud to present: Cidev - Insight SiP - Beckermus partnership

Beckermus Technologies has more than 20 years of experience in providing micro-assembly services. They support clients from prototyping through small amounts assembly and up to mid-high quantities (few 10K pcs/m). Facilities are class ISO 7/6/5 certified and ISO 13485: Medical devices, AS9100D aerospace, QMS certified, IPC-A-610 and MILL-STD 883 qualifications.

Microelectronics services include the following IC assembly technologies and applications:    beckermus_1

• Wire bonding

• Die attach -CMOS, CCD, MEMS, MOEMS, Pressure sensors, VCSEL,

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Laser diodes Microcontrollers and more:

• Flip chip • Encapsulation

• Chip on board/Chip on flex

• System in packages (SiP) and Multi-chip module (MCM)

• Wafer level packaging

• 3D stacked dies

• Wafer dicing/sorting

Micro optics/photonics assembly services:beckermus_3

• Optical modules assembly

• Active alignment

• Electro optics and photonics assembly

The partnership creates a perfect solution for companies in the phase of moving to bare-die micro/nano product by receiving an integral, complete design to product solution. The collaboration will help our customers reach an optimized and miniaturized end product, through a complete supply chain: from design service to production manufacturing

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